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The DARPA TRUST program established the potential usefulness of using an X-Ray microscope to analyze ICs at a synchrotron. We would like to further that development using a lab based X-Ray source. When utilizing a lab X-ray source, acquisition times for X-ray images increase significantly compared to using a synchrotron X-ray source. This is due to the decreased number of X-ray photons (i.e., X-ra ...

TECHNOLOGY AREA(S): Info Systemssensors, Electronics, Battlespace OBJECTIVE: Design and implement machine learning or machine vision technologies to determine the authenticity and security of microelectronics parts in weapon systems. These technologies may be purely software based or include a hardware component. DESCRIPTION: Determining the authenticity and security of microelectronics parts i ...

OUSD (R&E) CRITICAL TECHNOLOGY AREA(S): Microelectronics OBJECTIVE: Design and implement technologies to assist in the process of extracting a printed circuit board design non-destructively from a printed circuit board assembly. These technologies may be purely software based or include a hardware component. DESCRIPTION: The weapons systems of the Department of Defense (DoD) rely heavily on mic ...

TECHNOLOGY AREA(S): Materials, Sensors, Eletronics OBJECTIVE: Develop an automated & high throughput technology, which performs similar to the gas assisted etch (GAE) focused ion beam (FIB)-scanning electron microscope (SEM) for delayering an entire IC to perform 3D chip reconstruction for use in reverse engineering and physical failure analysis applications. DESCRIPTION: De-processing of Inte ...

OUSD (R&E) CRITICAL TECHNOLOGY AREA(S): Microelectronics OBJECTIVE: Design and implement a system that would automate the measurement of passive electronic components (capacitors, inductors, and resistors). The components can be measured in place or removed and measured in an automated fashion. DESCRIPTION: Manual measurement of passive devices requires a large amount of human resources to comp ...

TECHNOLOGY AREA(S): Sensors, Electronics, Battlespace OBJECTIVE: Develop a semiconductor device Fault Isolation tool that works across a wide range of technology processes. DESCRIPTION: Infrared (IR) Microscopes are used in the Failure Analysis (FA) and Fault Isolation (FI) of silicon-based semiconductor devices because of the fact that silicon is transparent to near-IR (NIR) light. Some of thes ...

TECHNOLOGY AREA(S): Sensors, Electronics OBJECTIVE: Develop an affordable and highly secure Supply Chain Risk Management (SCRM) system enhanced by blockchain technology. DESCRIPTION: Trusted & Assured microelectronics supply chains are globally distributed and offer many opportunities for supply chain interdiction and compromise by adversaries. An opportunity exists to establish a State of the ...

TECHNOLOGY AREA(S): Sensors OBJECTIVE: Develop a tool for automated, procedural delayering and polishing of semiconductor microelectronic devices DESCRIPTION: Sample preparation, in the world of semiconductor microelectronic devices, has proved to be one of the most critical aspects of Failure Analysis (FA), Fault Isolation (FI), and Reverse Engineering (RE). In addition to its criticality, it g ...

TECHNOLOGY AREA(S): Materialssensors, Electronics, Space, Platforms, Nuclear OBJECTIVE: Develop and validate predictive electronic device behavioral models by systematically correlating nano-scale material properties (e.g. through quantitative electron microscopy techniques) with macro-scale electrical properties determined via device electrical testing. DESCRIPTION: Radiation hardening, the pr ...

OUSD (R&E) CRITICAL TECHNOLOGY AREA(S): Microelectronics The technology within this topic is restricted under the International Traffic in Arms Regulation (ITAR), 22 CFR Parts 120-130, which controls the export and import of defense-related material and services, including export of sensitive technical data, or the Export Administration Regulation (EAR), 15 CFR Parts 730-774, which controls du ...