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NOTE: The Solicitations and topics listed on this site are copies from the various SBIR agency solicitations and are not necessarily the latest and most up-to-date. For this reason, you should visit the respective agency SBIR sites to read the official version of the solicitations and download the appropriate forms and rules.

Displaying 18131 - 18140 of 18924 results
  1. DMEA231-002: High-G Clock Source

    Release Date: 01-11-2023Open Date: 02-08-2023Due Date: 03-08-2023Close Date: 03-08-2023

    OUSD (R&E) CRITICAL TECHNOLOGY AREA(S): Microelectronics The technology within this topic is restricted under the International Traffic in Arms Regulation (ITAR), 22 CFR Parts 120-130, which controls the export and import of defense-related material and services, including export of sensitive technical data, or the Export Administration Regulation (EAR), 15 CFR Parts 730-774, which controls dual ...

    SBIRPhase I/Phase IIDepartment of DefenseDefense Microelectronics Activity
  2. DMEA231-003: High Voltage Package Encapsulation using Innovative and Advanced Materials

    Release Date: 01-11-2023Open Date: 02-08-2023Due Date: 03-08-2023Close Date: 03-08-2023

    OUSD (R&E) CRITICAL TECHNOLOGY AREA(S): Microelectronics OBJECTIVE: Development and characterization of new innovative encapsulation materials that are compatible with existing manufacturing methods, materials, and commercially available packages. Materials investigated shall be compared to the performance of established encapsulation materials used for high voltage power device packaging encapsu ...

    SBIRPhase I/Phase IIDepartment of DefenseDefense Microelectronics Activity
  3. DMEA231-004: Modular Cryogenic Dewar for Radiation Testing

    Release Date: 01-11-2023Open Date: 02-08-2023Due Date: 03-08-2023Close Date: 03-08-2023

    OUSD (R&E) CRITICAL TECHNOLOGY AREA(S): Space Technology, Microelectronics OBJECTIVE: To develop modular, open architecture, cryogenic-and-environmental-test Dewar system for radiation testing of microelectronics and other test articles. DESCRIPTION: Failure mechanisms of microelectronics and other components in radiation environments, such as those encountered by spacecraft, are often enhanced ...

    SBIRPhase I/Phase IIDepartment of DefenseDefense Microelectronics Activity
  4. DMEA231-005: Vertical Photoconductive Semiconductor Switch (PCSS) and Triggering Assembly

    Release Date: 01-11-2023Open Date: 02-08-2023Due Date: 03-08-2023Close Date: 03-08-2023

    OUSD (R&E) CRITICAL TECHNOLOGY AREA(S): Microelectronics The technology within this topic is restricted under the International Traffic in Arms Regulation (ITAR), 22 CFR Parts 120-130, which controls the export and import of defense-related material and services, including export of sensitive technical data, or the Export Administration Regulation (EAR), 15 CFR Parts 730-774, which controls dual ...

    SBIRPhase I/Phase IIDepartment of DefenseDefense Microelectronics Activity
  5. DMEA231-006: Ultra-Wideband Voltage Controlled Oscillator

    Release Date: 01-11-2023Open Date: 02-08-2023Due Date: 03-08-2023Close Date: 03-08-2023

    OUSD (R&E) CRITICAL TECHNOLOGY AREA(S): Microelectronics The technology within this topic is restricted under the International Traffic in Arms Regulation (ITAR), 22 CFR Parts 120-130, which controls the export and import of defense-related material and services, including export of sensitive technical data, or the Export Administration Regulation (EAR), 15 CFR Parts 730-774, which controls dual ...

    SBIRPhase I/Phase IIDepartment of DefenseDefense Microelectronics Activity
  6. DMEA231-007: SiC Stress Tuning

    Release Date: 01-11-2023Open Date: 02-08-2023Due Date: 03-08-2023Close Date: 03-08-2023

    OUSD (R&E) CRITICAL TECHNOLOGY AREA(S): Microelectronics OBJECTIVE: Mechanical stress tuning through Finite Element Analysis (FEA) modeling that can be used to predict silicon carbide (SiC) wafer warp/strength through processing steps such as power device fabrication, back grinding, stress relief processing, and backside metallization (BSM). DESCRIPTION: Stress engineering can be used for struct ...

    SBIRPhase I/Phase IIDepartment of DefenseDefense Microelectronics Activity
  7. DMEA231-008: Automated Measurement of Passive Devices in Printed Circuit Assemblies

    Release Date: 01-11-2023Open Date: 02-08-2023Due Date: 03-08-2023Close Date: 03-08-2023

    OUSD (R&E) CRITICAL TECHNOLOGY AREA(S): Microelectronics OBJECTIVE: Design and implement a system that would automate the measurement of passive electronic components (capacitors, inductors, and resistors). The components can be measured in place or removed and measured in an automated fashion. DESCRIPTION: Manual measurement of passive devices requires a large amount of human resources to comp ...

    SBIRPhase I/Phase IIDepartment of DefenseDefense Microelectronics Activity
  8. DMEA231-D01: Low Cost, High Power, Opening and Closing Switches

    Release Date: 01-11-2023Open Date: 02-08-2023Due Date: 03-08-2023Close Date: 03-08-2023

    OUSD (R&E) CRITICAL TECHNOLOGY AREA(S): Microelectronics, Directed Energy The technology within this topic is restricted under the International Traffic in Arms Regulation (ITAR), 22 CFR Parts 120-130, which controls the export and import of defense-related material and services, including export of sensitive technical data, or the Export Administration Regulation (EAR), 15 CFR Parts 730-774, whi ...

    SBIRPhase I/Phase IIDepartment of DefenseDefense Microelectronics Activity
  9. DMEA231-D02: Ultra-High Voltage Insulated Gate Bipolar Transistor on Silicon Carbide

    Release Date: 01-11-2023Open Date: 02-08-2023Due Date: 03-08-2023Close Date: 03-08-2023

    OUSD (R&E) CRITICAL TECHNOLOGY AREA(S): Microelectronics The technology within this topic is restricted under the International Traffic in Arms Regulation (ITAR), 22 CFR Parts 120-130, which controls the export and import of defense-related material and services, including export of sensitive technical data, or the Export Administration Regulation (EAR), 15 CFR Parts 730-774, which controls dual ...

    SBIRPhase I/Phase IIDepartment of DefenseDefense Microelectronics Activity
  10. MDA23-001: Expendable Ship Launched Sensor

    Release Date: 01-11-2023Open Date: 02-08-2023Due Date: 03-08-2023Close Date: 03-08-2023

    OUSD (R&E) CRITICAL TECHNOLOGY AREA(S): Integrated Network Systems-of-Systems The technology within this topic is restricted under the International Traffic in Arms Regulation (ITAR), 22 CFR Parts 120-130, which controls the export and import of defense-related material and services, including export of sensitive technical data, or the Export Administration Regulation (EAR), 15 CFR Parts 730-774, ...

    SBIRPhase I/Phase IIDepartment of DefenseMissile Defense Agency
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